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CDCDB2000ENPPR 数据表(PDF) 5 Page - Texas Instruments |
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CDCDB2000ENPPR 数据表(HTML) 5 Page - Texas Instruments |
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5 / 35 page ![]() Table 4-1. Pin Functions (continued) PIN I/O TYPE(2) DESCRIPTION NAME(1) NO. SBEN E2 I, S, PD Side-Band Interface enable input with internal 120-kΩ pulldown. Typically connected to GPIO of microcontroller. If unused, the pin can be left no connect. This pin disables the Output Enable (OE#) pins when asserted. LOW: OE# pins and SMBus enable bits control outputs, Side-Band interface disabled. HIGH: Side-Band Interface controls outputs, OE# pins and SMBus enable bits are disabled. SMBUS AND SMBUS ADDRESS SADR0 B4 I, S, PU / PD SMBus address strap bit[0]. This is a 3-level input that is decoded in conjunction with pin B8 to set SMBus address. It has internal 120-kΩ pullup / pulldown network biasing to VDD/2 when no connect. For a high-level input configuration, the pin should be pulled up to 3.3-V VDD through an external pullup resistor from 1k to 5k with 5% tolerance. For a low-level input configuration input, the pin should be pulled down to ground through an external pulldown resistor from 1k to 5k with 5% tolerance. For a mid-level input configuration, the pin should be left floating and not connected to VDD or ground. SADR1 B8 I, S, PU / PD SMBus address strap bit[1]. This is a 3-level input that is decoded in conjunction with pin B4 to set SMBus address. It has internal 120-kΩ pullup / pulldown network biasing to VDD/2 when no connect. For a high-level input configuration, the pin should be pulled up to 3.3-V VDD through an external pullup resistor from 1k to 5k with 5% tolerance. For a low-level input configuration, the pin should be pulled down to ground through an external pulldown resistor from 1k to 5k with 5% tolerance. For a mid-level input configuration, the pin should be left floating and not connected to VDD or ground. SMBCLK L5 I Clock pin of SMBus interface. Typically pulled up to 3.3-V VDD using external pullup resistor. The recommended pullup resistor value is > 8.5k. SMBDAT L4 I / O Data pin of SMBus interface. Typically pulled up to 3.3-V VDD using external pullup resistor. The recommended pullup resistor value is > 8.5k. SUPPLY VOLTAGE AND GROUND GND DAP G Ground. Connect ground pad to system ground. VDD B2, B6, B11, L2, L11 P Power supply input for LP-HCSL clock output channels. Connect to 3.3-V power supply rail with decoupling capacitor to GND. Place a 0.1-µF capacitor close to each supply pin between power supply and ground. VDD_A H2 P Power supply input for differential input clock. Connect to 3.3-V power supply rail with decoupling capacitor to GND. Place a 0.1-µF capacitor close to pin. NO CONNECT NC B3, B5, B7, B9, C2, D2, D11, F2, F11, G2, G11, J2, J11, K2, L3, L6, L7, L9, — Do not connect to GND or VDD. (1) The “#” symbol at the end of a pin name indicates that the active state occurs when the signal is at a low voltage level. When “#” is not present, the signal is active high. (2) The definitions below define the I/O type for each pin. • I = Input • O = Output • I / O = Input / Output • PU / PD = Internal 120-kΩ Pullup / Pulldown network biasing to VDD/2 • PD = Internal 120-kΩ Pulldown • S = Hardware Configuration Pin • P = Power Supply • G = Ground www.ti.com CDCDB2000 SNAS787B – NOVEMBER 2019 – REVISED OCTOBER 2024 Copyright © 2024 Texas Instruments Incorporated Submit Document Feedback 5 Product Folder Links: CDCDB2000 |
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