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AD3530 数据表(PDF) 8 Page - Analog Devices

部件名 AD3530
功能描述  8-Channel, 16-Bit Voltage Output DACs, On-Chip Reference, SPI
PDF  45 Pages
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制造商  AD [Analog Devices]
网页  http://www.analog.com
标志 AD - Analog Devices

AD3530 数据表(HTML) 8 Page - Analog Devices

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Data Sheet
AD3530/AD3530R
ABSOLUTE MAXIMUM RATINGS
analog.com
Rev. 0 | 8 of 45
Table 6. Absolute Maximum Ratings
Parameter
Rating
VDD to GND
−0.3V to +6.5V
IOVDD to GND
−0.3V to +2.1V
VOUTn to GND
−0.3V to VDD + 0.3V
VREF1 to GND
−0.3V to VDD + 0.3V
Digital Input Voltage to GND
−0.3V to IOVDD + 0.3V
Temperature
Operating Junction Temperature Range
−40°C to +125°C
Storage Temperature Range
−65°C to +150°C
Absolute Maximum Junction Temperature
150°C
Reflow Soldering Peak Temperature, Pb-Free (J-
STD-020)
260°C
1 Configured as the reference input pin.
Stresses at or above those listed under Absolute Maximum Ratings
may cause permanent damage to the product. This is a stress
rating only; functional operation of the product at these or any other
conditions above those indicated in the operational section of this
specification is not implied. Operation beyond the maximum operat-
ing conditions for extended periods may affect product reliability.
THERMAL RESISTANCE
Thermal performance is directly linked to printed circuit board
(PCB) design and operation environment. Careful attention to PCB
thermal design is required.
θJA is the natural convection junction to ambient thermal resistance
measured in a one cubic foot, sealed enclosure. θJB is the junction
to board thermal resistance. θJC is the is the junction to case
thermal resistance. ᴪJT is the is the junction to top thermal charac-
terization parameter. ᴪJB is the is the junction to board thermal
characterization.
Table 7. Thermal Resistance
Package Type
θJA
θJB
θJC
ᴪJT
ᴪJB
Unit
CB-25-111
43.71 9.64
4.75
4.42
9.64
°C/W
1 Simulation values on JEDEC 2S2P board with 4 thermal vias, still air (0m/sec
airflow).
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Charged devi-
ces and circuit boards can discharge without detection. Although
this product features patented or proprietary protection circuitry,
damage may occur on devices subjected to high energy ESD.
Therefore, proper ESD precautions should be taken to avoid
performance degradation or loss of functionality.



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