Pad dimensions and positions (in µm)

STV7622

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Pad dimensions and positions (in µm)

The reference (x=0, y=0) is the centre of the die. Output pad pitch is 76.5 µm.

Pad placement coordinate values correspond to the center of each bump pad center. Pad

size is specified for bumping.

Table 13.

Pad placement and bump pad dimensions (in microns)

Lead pad name

Pad placements

Bump dimensions

X

Y

X

Y

TOP SIDE from left to right

OUT192

-7303.1

624.2

43.5

65.6

OUT191

-7226.6

624.2

43.5

65.6

OUT190

-7150.1

624.2

43.5

65.6

OUT189

-7073.6

624.2

43.5

65.6

OUT188

-6997.1

624.2

43.5

65.6

OUT187

-6920.6

624.2

43.5

65.6

OUT186

-6844.1

624.2

43.5

65.6

OUT185

-6767.6

624.2

43.5

65.6

OUT184

-6691.1

624.2

43.5

65.6

OUT183

-6614.6

624.2

43.5

65.6

OUT182

-6538.1

624.2

43.5

65.6

OUT181

-6461.6

624.2

43.5

65.6

OUT180

-6385.1

624.2

43.5

65.6

OUT179

-6308.6

624.2

43.5

65.6

OUT178

-6232.1

624.2

43.5

65.6

OUT177

-6155.6

624.2

43.5

65.6

OUT176

-6079.1

624.2

43.5

65.6

OUT175

-6002.6

624.2

43.5

65.6

OUT174

-5926.1

624.2

43.5

65.6

OUT173

-5849.6

624.2

43.5

65.6

OUT172

-5773.1

624.2

43.5

65.6

OUT171

-5696.6

624.2

43.5

65.6

OUT170

-5620.1

624.2

43.5

65.6

OUT169

-5543.6

624.2

43.5

65.6

OUT168

-5467.1

624.2

43.5

65.6

OUT167

-5390.6

624.2

43.5

65.6

OUT166

-5314.1

624.2

43.5

65.6