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STV7622 数据表(PDF) 28 Page - STMicroelectronics |
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STV7622 数据表(HTML) 28 Page - STMicroelectronics |
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28 / 32 page ![]() Pad dimensions and positions (in µm) STV7622 28/32 RIGHT SIDE from top to bottom VSSP4 7461.3 635.2 65.6 43.5 VSSP5 7473.2 560.3 65.6 43.5 VSSP6 7473.2 485.4 65.6 43.5 VPP4 7473.2 260.1 65.6 43.5 VPP5 7473.2 185.2 65.6 43.5 VPP6 7473.2 110.3 65.6 43.5 DUMMY 7473.2 35.5 65.6 43.5 VSSLOG2 7473.2 -39.4 65.6 43.5 VSSSUB2 7473.2 -114.3 65.6 43.5 VDD2 7473.2 -189.2 65.6 43.5 VCC2 7473.2 -555.2 65.6 43.5 DUMMY 7461.3 -633.5 65.6 43.5 BOTTOM SIDE from right to left DUMMY 6838.2 -622.5 43.5 65.6 DUMMY 6749.7 -622.5 43.5 65.6 DUMMY 6673.1 -622.5 43.5 65.6 DUMMY 6486.3 -622.5 43.5 65.6 DUMMY 6409.8 -622.5 43.5 65.6 DUMMY 6333.3 -622.5 43.5 65.6 DUMMY 6256.8 -622.5 43.5 65.6 DUMMY 6103.6 -622.5 43.5 65.6 TEST2 5928.9 -622.5 43.5 65.6 TEST1 5617.8 -622.5 43.5 65.6 VDD8 4783.9 -622.5 43.5 65.6 BS2 4634.4 -622.5 43.5 65.6 VSSLOG7 4466.3 -622.5 43.5 65.6 BS1 4325.9 -622.5 43.5 65.6 VDD7 4095.4 -622.5 43.5 65.6 DIR 3949.6 -622.5 43.5 65.6 VSSLOG6 3709.5 -622.5 43.5 65.6 FS1 3560.2 -622.5 43.5 65.6 VDD6 3327.0 -622.5 43.5 65.6 Table 13. Pad placement and bump pad dimensions (in microns) (continued) Lead pad name Pad placements Bump dimensions X Y X Y |
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