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ST7LITE0XY0 数据表(PDF) 111 Page - STMicroelectronics |
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ST7LITE0XY0 数据表(HTML) 111 Page - STMicroelectronics |
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111 / 124 page  ST7LITE0xY0, ST7LITESxY0 111/124 14.2 THERMAL CHARACTERISTICS Notes: 1. The maximum chip-junction temperature is based on technology characteristics. 2. The maximum power dissipation is obtained from the formula PD = (TJ -TA) / RthJA. The power dissipation of an application can be defined by the user with the formula: PD=PINT+PPORT where PINT is the chip internal power (IDDxVDD) and PPORT is the port power dissipation depending on the ports used in the application. Symbol Ratings Value Unit RthJA Package thermal resistance SO16 (junction to ambient) DIP16 95 TBD °C/W TJmax Maximum junction temperature 1) 150 °C PDmax Power dissipation 2) 500 mW |
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