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ST7LITE0XY0 数据表(PDF) 109 Page - STMicroelectronics |
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ST7LITE0XY0 数据表(HTML) 109 Page - STMicroelectronics |
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109 / 124 page ![]() ST7LITE0xY0, ST7LITESxY0 109/124 14 PACKAGE CHARACTERISTICS In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a Lead-free second level in- terconnect. The category of second Level Inter- connect is marked on the package and on the in- ner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to solder- ing conditions are also marked on the inner box la- bel. ECOPACK is an ST trademark. ECOPACK speci- fications are available at: www.st.com. 14.1 PACKAGE MECHANICAL DATA Figure 86. 20-Lead Very thin Fine pitch Quad Flat No-Lead Package Dim. mm inches1) Note 1. Values in inches are converted from mm and rounded to 4 decimal digits. Min Typ Max Min Typ Max A 0.80 0.85 0.90 0.0315 0.0335 0.0354 A1 0.00 0.02 0.05 0.0008 0.0020 A3 0.02 0.0008 b 0.25 0.30 0.35 0.0098 0.0118 0.0138 D 5.00 0.1969 D2 3.10 3.25 3.35 0.1220 0.1280 0.1319 E 6.00 0.2362 E2 4.10 4.25 4.35 0.1614 0.1673 0.1713 e 0.80 0.0315 L 0.45 0.50 0.55 0.0177 0.0197 0.0217 ddd 0.08 0.0031 Number of Pins N 20 |
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