Bosch Sensortec | BST-BMP581-DS004-11

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© Bosch Sensortec GmbH 2023 | All rights reserved, also regarding any disposal, exploitation, reproduction, editing, distribution,

Document number: BST-BMP581-DS004-11

as well as in the event of applications for industrial property rights

7.33 Register (0x36) Over-sampling rate (OSR) configuration ...................................................................................64

7.34 Register (0x37) Output data rate (ODR) configuration........................................................................................64

7.35 Register (0x38) Effective over-sampling rate (OSR) configuration.....................................................................66

7.36 Register (0x7E) Command Register ...................................................................................................................67

8 Package........................................................................................................................................................................68

8.1 BMP581 Package Outline Dimensions ...............................................................................................................68

8.1.1

Top View .................................................................................................................................................68

8.1.2

Bottom View............................................................................................................................................68

8.1.3

Side view ................................................................................................................................................69

8.2 Landing pattern....................................................................................................................................................69

8.3 Device Marking....................................................................................................................................................70

8.3.1

Mass Production Devices .......................................................................................................................70

8.3.2

Engineering Samples..............................................................................................................................70

8.4 Moisture Sensitivity Level and Soldering ............................................................................................................71

8.4.1

MSL and device storage.........................................................................................................................71

8.4.2

Reflow Solder profile...............................................................................................................................71

8.5 Environmental Safety ..........................................................................................................................................71

8.5.1

RoHS ......................................................................................................................................................71

8.5.2

Halogen content......................................................................................................................................71

8.6 Internal Package Structure..................................................................................................................................71

8.7 Tape and reel specification..................................................................................................................................72

8.7.1

Dimensions.............................................................................................................................................72

8.7.2

Orientation within the reel.......................................................................................................................72

9 Legal disclaimer ..........................................................................................................................................................73

10 Document history and modification..........................................................................................................................74