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BMP581 数据表(PDF) 69 Page - Bosch Sensortec GmbH |
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BMP581 数据表(HTML) 69 Page - Bosch Sensortec GmbH |
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69 / 75 page  Bosch Sensortec | BST-BMP581-DS004-11 69 | 75 © Bosch Sensortec GmbH 2023 | All rights reserved, also regarding any disposal, exploitation, reproduction, editing, distribution, Document number: BST-BMP581-DS004-11 as well as in the event of applications for industrial property rights 8.1.3 Side view Figure 31: BMP581 side view 8.2Landing pattern It is recommended to use a land pattern with a size of Footprint +25 µm on each side. We recommend at least 200 µm distance between the pads. We do not recommend vias or traces under the BMP581. Furthermore, it is recommended that there is no solder mask under the sensor. The recommended horizontal clearance for the solder mask is 20 µm on each side. If the solder mask or other material underneath the sensor gets in contact with the sensor, there may be a negative impact on performance. Figure 32: BMP581 landing pattern (bottom view) |
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