ADL6331ACCZB-R7 datasheet(35/54 Pages) AD

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Data Sheet

ADL6331

BASIC CONNECTIONS

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Rev. B | 35 of 54

Figure 95. Basic Connections

Table 18. Basic Connections

Functional Blocks

Pin No.

Mnemonic

Description

Basic Connection

Chip Address Selection

1, 23, 24

CA2, CA1, CA0

SPI chip address selects

Chip address selection.

Ground

2, 5, 14, 16, 17

GND

Ground

Connect the GND pins to the ground of the

PCB.

RF Input

3, 4

RFINP, RFINN

RF differential input

50 Ω differential input. AC-coupled is al-

ways recommended.

Preprogrammed Mode

6, 13

ATTSEL1, ATTSEL0

Preprogrammed mode selection

MUXOUT

Analog voltage output from the tempera-

ture sensor

Voltage measurement pin for reading chip

temperature. Leave as no connect when

not in use.

3.3 V

8 to 11

V33AMP1A, V33AMP1,

V33AMP2A, V33AMP2

Amplifier, analog supply voltage

Decouple Pin 8 to Pin 11 via 220 pF, 0.1

µF capacitors to ground. Ensure that the

decoupling capacitors are located close to

the pins.

Device Enable

ENP

Active-high for normal operation

Decouple Pin 22 via 220 pF, 0.1 µF capaci-

tors to ground. Ensure that the decoupling

capacitors are located close to the pin.

RF Output

RFOUT

RF single-ended output

50 Ω single-ended output. AC-coupled is

always recommended.

Serial Port

SDO

SPI data input

1.8 V to 3.3 V tolerant logic levels.

SDIO

SPI date input and output

1.8 V to 3.3 V tolerant logic levels.

SCLK

SPI clock

1.8 V to 3.3 V tolerant logic levels.

CSB

Active-low chip select

1.8 V to 3.3 V tolerant logic levels.

3.3 V

V33FUSE

Digital, DSA, and other bias voltage

EPAD

Exposed pad

Exposed Pad. The exposed pad must be

connected to ground for electrical and ther-

mal purposes.

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