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STR910FAM32 数据表(PDF) 68 Page - STMicroelectronics |
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STR910FAM32 数据表(HTML) 68 Page - STMicroelectronics |
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68 / 99 page ![]() Electrical characteristics STR91xFAx32 STR91xFAx42 STR91xFAx44 68/99 7.8.2 Flash memory characteristics VDDQ = 2.7 - 3.6V, VDD = 1.65 - 2V, TA = -40 / 85 °C unless otherwise specified. Note: Flash read access for sequential addresses is 0 wait states at 96 MHz. Flash read access for non-sequential accesses requires 2 wait states when FMI clock is above 66 MHz. See STR91xF Flash Programming Manual for more information. Table 24. Flash memory program/erase characteristics Parameter Test Conditions Value Unit Typ(1) Typ after 100K W/E cycles(1) Max Bank erase Primary Bank (512 Kbytes) 8 9 11.5 s Primary Bank (256 Kbytes) 4 4.5 6 s Secondary Bank (32 Kbytes) 700 750 950 ms Sector erase Of Primary Bank (64 Kbytes) 1300 1400 1800 ms Of Secondary Bank (8 Kbytes) 300 320 450 ms Bank program Primary Bank (512 Kbytes) 3700 4700 5100 ms Primary Bank (256 Kbytes) 1900 2000 2550 ms Secondary Bank (32 Kbytes) 250 260 320 ms Sector program Of Primary Bank (64 Kbytes) 500 520 640 ms Of Secondary Bank (8 Kbytes) 60 62 80 ms Word program Half word (16 bits) 8 9 11 µs 1. VDD = 1.8V, VDDQ = 3.3V, TA = 25°C. Table 25. Flash memory endurance Parameter Test Conditions Value Unit Min Typ Max Program/erase cycles Per word 100K cycles Data retention 20 years |
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