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PACKAGE OUTLINE

C

32X

0.30

0.18

3.45 0.1

32X

0.5

0.3

0.8

0.7

(DIM A) TYP

0.05

0.00

28X 0.5

2X

3.5

2X 3.5

A

5.15

4.85

B

5.15

4.85

(0.2) TYP

WQFN - 0.8 mm max height

RTV0032E

PLASTIC QUAD FLATPACK - NO LEAD

4225196/A 08/2019

SIDE WALL LEAD

METAL THICKNESS

DIM A

OPTION 1

OPTION 2

0.1

0.2

PIN 1 INDEX AREA

0.08 C

SEATING PLANE

1

8

17

24

9

16

32

25

(OPTIONAL)

PIN 1 ID

0.1

C A B

0.05

C

EXPOSED

THERMAL PAD

33

SYMM

SYMM

NOTES:

1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing

per ASME Y14.5M.

2. This drawing is subject to change without notice.

3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance.

SCALE 3.000