NOTES:

1.

All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing

per ASME Y14.5M.

2. This drawing is subject to change without notice.

3. The package thermal pad must be soldered to the printed circuit board for optimal thermal and mechanical performance.

PACKAGE OUTLINE

4218895/B 03/2022

www.ti.com

VSON - 1 mm max height

PLASTIC QUAD FLATPACK- NO LEAD

DRZ0012A

A

0.08 C

0.1

C A B

0.05

C

B

SYMM

SYMM

4.15

3.85

2.65

2.35

SEATING PLANE

C

PIN 1 ID

(OPTIONAL)

1

6

12

7

13

PIN 1 INDEX AREA

1

0.8

0.05

0

2X 2

10X 0.4

12X 0.3

0.1

12X 0.5

0.3

2.55

2.35

2X (0.2)

2.05

1.85

(0.2) TYP