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CDCLVC1102 数据表(PDF) 2 Page - Texas Instruments

部件名 CDCLVC1102
功能描述  CDCLVC11xx 3.3-V and 2.5-V LVCMOS High-Performance Clock Buffer Family
PDF  37 Pages
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制造商  TI2 [Texas Instruments]
网页  https://www.ti.com
标志 TI2 - Texas Instruments

CDCLVC1102 数据表(HTML) 2 Page - Texas Instruments

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CDCLVC1102, CDCLVC1103, CDCLVC1104
CDCLVC1106, CDCLVC1108, CDCLVC1110, CDCLVC1112
SCAS895B – MAY 2010 – REVISED FEBRUARY 2017
www.ti.com
Product Folder Links: CDCLVC1102 CDCLVC1103 CDCLVC1104 CDCLVC1106 CDCLVC1108 CDCLVC1110
CDCLVC1112
Submit Documentation Feedback
Copyright © 2010–2017, Texas Instruments Incorporated
Table of Contents
1
Features .................................................................. 1
2
Applications ........................................................... 1
3
Description ............................................................. 1
4
Revision History..................................................... 2
5
Pin Configuration and Functions ......................... 3
6
Specifications......................................................... 5
6.1
Absolute Maximum Ratings ...................................... 5
6.2
ESD Ratings.............................................................. 5
6.3
Recommended Operating Conditions ....................... 5
6.4
Thermal Information .................................................. 6
6.5
Electrical Characteristics........................................... 6
6.6
Switching Characteristics .......................................... 7
6.7
Typical Characteristics .............................................. 7
7
Parameter Measurement Information .................. 8
8
Detailed Description ............................................ 10
8.1
Overview ................................................................. 10
8.2
Functional Block Diagram ....................................... 10
8.3
Feature Description................................................. 10
8.4
Device Functional Modes........................................ 10
9
Application and Implementation ........................ 11
9.1
Application Information............................................ 11
9.2
Typical Application ................................................. 11
10
Power Supply Recommendations ..................... 12
10.1
Power Considerations ........................................... 13
11
Layout................................................................... 14
11.1
Layout Guidelines ................................................. 14
11.2
Layout Example .................................................... 14
12
Device and Documentation Support ................. 15
12.1
Related Links ........................................................ 15
12.2
Receiving Notification of Documentation Updates 15
12.3
Community Resources.......................................... 15
12.4
Trademarks ........................................................... 15
12.5
Electrostatic Discharge Caution ............................ 15
12.6
Glossary ................................................................ 15
13
Mechanical, Packaging, and Orderable
Information ........................................................... 15
4 Revision History
Changes from Revision A (October 2014) to Revision B
Page
Changed Packaging name from TTSOP to TSSOP in Device Information Table ................................................................. 1
Changed CDCLVC1110 Y8 pin number from: 10 to: 12 ........................................................................................................ 3
Changed CDCLVC1110 Y9 pin number from: — to: 10......................................................................................................... 3
Moved Tstg from ESD Ratings to Absolute Maximum Ratings .............................................................................................. 5
Added Receiving Notification of Documentation Updates and Community Resources sections ......................................... 15
Changes from Original (May 2010) to Revision A
Page
Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation
section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and
Mechanical, Packaging, and Orderable Information section .................................................................................................. 1



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