CDCLVC

1112

1

1G

2

GND

3

CLKIN

4

5

6

7

8

9

10

16

17

18

19

20

21

22

23

24

Y 1

Y 2

VDD

VDD

Y 3

Y4

VDD

GND

Y0

Y11

Y 5

GND

Y6

Y 7

Y9

VDD

Y 8

GND

11

12

13

14

15

GND

Y 10

VDD

CDCLVC

1106

CDCLVC

1110

CDCLVC

1102

CDCLVC

1103

CDCLVC

1104

CDCLVC

1108

Y0

Y1

Y2

Y3

Yn

CLKIN

LV

CMOS

1G

LV

CMOS

LV

CMOS

LV

CMOS

LV

CMOS

LV

CMOS

•

•

•

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An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,

intellectual property matters and other important disclaimers. PRODUCTION DATA.

CDCLVC1102, CDCLVC1103, CDCLVC1104

CDCLVC1106, CDCLVC1108, CDCLVC1110, CDCLVC1112

SCAS895B – MAY 2010 – REVISED FEBRUARY 2017

CDCLVC11xx 3.3-V and 2.5-V LVCMOS High-Performance Clock Buffer Family

1

1 Features

1

•

High-Performance 1:2, 1:3, 1:4, 1:6, 1:8, 1:10,

1:12 LVCMOS Clock Buffer Family

•

Very Low Pin-to-Pin Skew < 50 ps

•

Very Low Additive Jitter < 100 fs

•

Supply Voltage: 3.3 V or 2.5 V

•

fmax = 250 MHz for 3.3 V

fmax = 180 MHz for 2.5 V

•

Operating Temperature Range: –40°C to 85°C

•

Available in 8-, 14-, 16-, 20-, 24-Pin TSSOP

Package (All Pin-Compatible)

2 Applications

General-Purpose Communication, Industrial, and

Consumer Applications

3 Description

The CDCLVC11xx is a modular, high-performance,

low-skew, general-purpose clock buffer family from

Texas Instruments.

The entire family is designed with a modular

approach in mind. It is intended to round up TI's

series of LVCMOS clock generators.

Seven different fan-out variations, 1:2 to 1:12, are

available. All of the devices are pin-compatible to

each other for easy handling.

All family members share the same high performing

characteristics such as low additive jitter, low skew,

and wide operating temperature range.

The CDCLVC11xx supports an asynchronous output

enable control (1G) which switches the outputs into a

low state when 1G is low.

The CDCLVC11xx family operates in a 2.5-V and

3.3-V

environment

and

are

characterized

for

operation from –40°C to 85°C.

Device Information(1)

PART NUMBER

PACKAGE

BODY SIZE (NOM)

CDCLVC1102

TSSOP (8)

3.00 mm × 4.40 mm

CDCLVC1103

CDCLVC1104

CDCLVC1106

TSSOP (14)

5.00 mm × 4.40 mm

CDCLVC1108

TSSOP (16)

CDCLVC1110

TSSOP (20)

6.50 mm × 4.40 mm

CDCLVC1112

TSSOP (24)

7.80 mm × 4.40 mm

(1) For all available packages, see the orderable addendum at

the end of the data sheet.

Functional Block Diagram