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LP5569 数据表(PDF) 4 Page - Texas Instruments

部件名 LP5569
功能描述  LP5569 Nine-Channel I2C RGB LED Driver With Engine Control and Charge Pump
PDF  93 Pages
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制造商  TI2 [Texas Instruments]
网页  https://www.ti.com
标志 TI2 - Texas Instruments

LP5569 数据表(HTML) 4 Page - Texas Instruments

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LP5569
SNVSAP8A – JULY 2017 – REVISED SEPTEMBER 2017
www.ti.com
Product Folder Links: LP5569
Submit Documentation Feedback
Copyright © 2017, Texas Instruments Incorporated
Pin Functions (continued)
PIN
TYPE(1)
DESCRIPTION
NAME
NO.
GPIO/TRIG/INT
7
I, OD
General-purpose input or open-drain output, or trigger input or open-drain output, or
interrupt open-drain output. This pin function is configured in the I2C registers. By default
this pin is a general-purpose output (open-drain) and can be left floating if not used.
LED0
19
A
LED current sink 0. If not used, this pin can be left floating.
LED1
18
A
LED current sink 1. If not used, this pin can be left floating.
LED2
17
A
LED current sink 2. If not used, this pin can be left floating.
LED3
16
A
LED current sink 3. If not used, this pin can be left floating.
LED4
15
A
LED current sink 4. If not used, this pin can be left floating.
LED5
14
A
LED current sink 5. If not used, this pin can be left floating.
LED6
13
A
LED current sink 6. If not used, this pin can be left floating.
LED7
12
A
LED current sink 7. If not used, this pin can be left floating.
LED8
11
A
LED current sink 8. If not used, this pin can be left floating.
PGND
21
G
Charge-pump power ground. Connect to AGND, exposed thermal pad, and common
ground plane.
SCL
9
I
I2C bus clock line. If not used, this pin must be connected to GND or VIN.
SDA
8
I, OD
I2C bus data line. If not used, this pin must be connected to GND or VIN.
V1P8
10
P
Input power for digital circuitry.
VIN
3
P
Input power, a 1-µF capacitor must be connected between PGND and this pin.
VOUT
22
A
Charge-pump output voltage. If charge pump is used, a 1-µF capacitor must be
connected between PGND and this pin. If charge pump is not used or is used in 1×
mode only, the capacitor can be omitted.
Exposed thermal
pad
Must be connected to AGND (pin 4), PGND (pin 21), and common ground plane. See
Layout Example. Must be soldered to achieve appropriate power dissipation and
mechanical reliability.



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