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LP5569 数据表(PDF) 4 Page - Texas Instruments |
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LP5569 数据表(HTML) 4 Page - Texas Instruments |
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4 / 93 page ![]() 4 LP5569 SNVSAP8A – JULY 2017 – REVISED SEPTEMBER 2017 www.ti.com Product Folder Links: LP5569 Submit Documentation Feedback Copyright © 2017, Texas Instruments Incorporated Pin Functions (continued) PIN TYPE(1) DESCRIPTION NAME NO. GPIO/TRIG/INT 7 I, OD General-purpose input or open-drain output, or trigger input or open-drain output, or interrupt open-drain output. This pin function is configured in the I2C registers. By default this pin is a general-purpose output (open-drain) and can be left floating if not used. LED0 19 A LED current sink 0. If not used, this pin can be left floating. LED1 18 A LED current sink 1. If not used, this pin can be left floating. LED2 17 A LED current sink 2. If not used, this pin can be left floating. LED3 16 A LED current sink 3. If not used, this pin can be left floating. LED4 15 A LED current sink 4. If not used, this pin can be left floating. LED5 14 A LED current sink 5. If not used, this pin can be left floating. LED6 13 A LED current sink 6. If not used, this pin can be left floating. LED7 12 A LED current sink 7. If not used, this pin can be left floating. LED8 11 A LED current sink 8. If not used, this pin can be left floating. PGND 21 G Charge-pump power ground. Connect to AGND, exposed thermal pad, and common ground plane. SCL 9 I I2C bus clock line. If not used, this pin must be connected to GND or VIN. SDA 8 I, OD I2C bus data line. If not used, this pin must be connected to GND or VIN. V1P8 10 P Input power for digital circuitry. VIN 3 P Input power, a 1-µF capacitor must be connected between PGND and this pin. VOUT 22 A Charge-pump output voltage. If charge pump is used, a 1-µF capacitor must be connected between PGND and this pin. If charge pump is not used or is used in 1× mode only, the capacitor can be omitted. Exposed thermal pad — — Must be connected to AGND (pin 4), PGND (pin 21), and common ground plane. See Layout Example. Must be soldered to achieve appropriate power dissipation and mechanical reliability. |
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