LP5569 datasheet(5/93 Pages) TI2

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LP5569

www.ti.com

SNVSAP8A – JULY 2017 – REVISED SEPTEMBER 2017

Product Folder Links: LP5569

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(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

VOUT cannot be forced to a power supply during device shutdown.

7 Specifications

7.1 Absolute Maximum Ratings

over operating ambient temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

Voltage on VIN, CLK, ADDR, EN/PWM, GPIO/TRIG/INT, SCL, SDA,

VOUT(2)

–0.3

Voltage on LED0 to LED8, C1–, C2–, C1+, C2+

−0.3

VVIN + 0.3 V with 6 V max.

Voltage on V1P8

−0.3

Continuous power dissipation

Internally limited

Junction temperature, TJ-MAX

–40

125

°C

Storage temperature, Tstg

−65

150

°C

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

7.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic discharge

Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)

±2500

Charged-device model (CDM), per JEDEC specification JESD22-

C101(2)

±250

(1)

In applications where high power dissipation and/or poor PCB cooling status is present, the maximum ambient temperature might

require derating. Maximum ambient temperature (TA-MAX) is dependent on the maximum operating junction temperature (TJ-MAX-OP =

125°C), the maximum power dissipation of the device in the application (PD-MAX), and the junction-to ambient thermal resistance of the

device in the application (RθJA), as given by the equation: TA-MAX = TJ-MAX-OP – (RθJA × PD-MAX).

7.3 Recommended Operating Conditions

over operating ambient temperature range (unless otherwise noted)

MIN

MAX

UNIT

Input voltage on VIN

2.5

5.5

Voltage on LED0 to LED8, C1–, C2–, C1+, C2+, VOUT

VVIN

Voltage on CLK, ADDR, EN/PWM, GPIO/TRIG/INT, SDA, SCL

VVIN

Input voltage on V1P8

1.65

1.95

Output current on VOUT

160

Operating ambient temperature, TA

(1)

−40

°C

(1)

For more information about traditional and new thermal metrics, see Semiconductor and IC Package Thermal Metrics.

7.4 Thermal Information

THERMAL METRIC(1)

LP5569

UNIT

RTW (WQFN)

24 PINS

RθJA

Junction-to-ambient thermal resistance

35.8

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

26.7

°C/W

RθJB

Junction-to-board thermal resistance

13.1

°C/W

ψJT

Junction-to-top characterization parameter

0.4

°C/W

ψJB

Junction-to-board characterization parameter

13.1

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

4.6

°C/W

LP5569 数据表(PDF) 5 Page - Texas Instruments

LP5569 数据表(HTML) 5 Page - Texas Instruments

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LP5569 数据表(PDF) 5 Page - Texas Instruments

LP5569 数据表(HTML) 5 Page - Texas Instruments

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