UCD7232

SLUSAH3

– MAY 2011

www.ti.com

ABSOLUTE MAXIMUM RATINGS

(1)

over operating free-air temperature range (unless otherwise noted)

VALUE

PARAMETER

UNIT

MIN

MAX

Supply voltage, VIN

–0.3

16

V

VBST DC

–0.3

23

VBST Pulse (VSWat 20V < 400ns)

–0.3

27

Bootstrap voltage

V

VBST Pulse (VSWat 22V < 64ns)

–0.3

29

VBST Pulse (VSWat 30V < 16ns)

–0.3

37

Gate drive supply voltage

VGG (Externally supplied)

–0.3

7

V

HS Gate

– SW

–0.3

7

Output gate drive voltage

V

LS Gate

PGND

– 0.3

VGG+0.3

VSW DC

–1

16

VSW Pulse < 400 ns, E = 20 µJ

–2

20

Switch node voltage

V

VSW Pulse < 64 ns

–5

22

VSW Pulse < 16 ns

–10

30

CSP, CSN, RDLY

–0.3

5.6

Analog inputs

ILIM

–0.3

3.6

V

HS Sense

–0.3

16

PWM, SRE, SRE Mode

–0.3

5.6

Digital inputs

V

VGG DIS

–0.3

3.6

Analog outputs

IMON

–0.3

3.6

V

Digital outputs

FLT

–0.3

3.6

V

Human body model

2000

ESD Rating

V

Charged device model

500

Operating ambient temperature, TA

–40

125

°C

Operating junction temperature, TJ

–40

150

°C

Storage temperature, TSTG

–65

150

°C

(1)

Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings

only and functional operation of the device at these or any other condition beyond those indicated is not implied. Exposure to

absolute-maximum-rated conditions for extended periods may affect device reliability. All voltages are with respect to AGND. Currents

are positive into, negative out of the specified terminal. Consult company packaging information for thermal limitations and

considerations of packages.

THERMAL INFORMATION

UCD7232

THERMAL METRIC(1)

UNITS

RTJ (20 PINS)

θJA

Junction-to-ambient thermal resistance

38.2

θJCtop

Junction-to-case (top) thermal resistance

34.4

θJB

Junction-to-board thermal resistance

15.7

°C/W

ψJT

Junction-to-top characterization parameter

0.4

ψJB

Junction-to-board characterization parameter

15.7

θJCbot

Junction-to-case (bottom) thermal resistance

5.9

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

4

Copyright

© 2011, Texas Instruments Incorporated