6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)(1)

MIN

NOM

MAX

UNIT

VIN

Input supply voltage

2.5

24

V

VOUT

Output voltage

1.205

5

V

IOUT

Output current

0

150

mA

CIN

Input capacitor(2)

0

0.047

µF

COUT

Output capacitor (for legacy chip only)

0.47

1

Output capacitor (for new chip only) (3)

1

TJ

Operating junction temperature

-40

125

°C

(1)

All voltages are with respect to GND.

(2)

An input capacitor is not required for LDO stability. However, an input capacitor with an effective value of 0.047 μF is

recommended to counteract the effect of source resistance and inductance, which may in some cases cause symptoms of system

level instability such as ringing or oscillation, especially in the presence of load transients.

(3)

All capacitor values are assumed to derate to 50% of the nominal capacitor value. Maintain an effective output capacitance of 0.47 μF

minimum for the stability.

Thermal Information

THERMAL METRIC(1)

Legacy Chip

New Chip

UNIT

DBV (SOT-23)

DBV (SOT-23)

5 PINS

5 PINS

RθJA

Junction-to-ambient thermal resistance

213.1

170.8

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

110.9

68.7

°C/W

RθJB

Junction-to-board thermal resistance

97.4

76.7

°C/W

ψJT

Junction-to-top characterization parameter

22.0

10.3

°C/W

ψJB

Junction-to-board characterization parameter

78.4

76.3

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC package thermal metrics application

report.

www.ti.com

TLV704

SBVS148F – SEPTEMBER 2010 – REVISED MARCH 2023

Copyright © 2023 Texas Instruments Incorporated

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