8 Device and Documentation Support

8.1 Receiving Notification of Documentation Updates

To receive notification of documentation updates, navigate to the device product folder on ti.com. Click on

Notifications to register and receive a weekly digest of any product information that has changed. For change

details, review the revision history included in any revised document.

8.2 Support Resources

TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight

from the experts. Search existing answers or ask your own question to get the quick design help you need.

Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do

not necessarily reflect TI's views; see TI's Terms of Use.

8.3 Trademarks

TI E2E™ is a trademark of Texas Instruments.

All trademarks are the property of their respective owners.

8.4 Electrostatic Discharge Caution

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled

with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may

be more susceptible to damage because very small parametric changes could cause the device not to meet its published

specifications.

8.5 Glossary

TI Glossary

This glossary lists and explains terms, acronyms, and definitions.

9 Revision History

NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

Changes from Revision B (October 2023) to Revision C (July 2024)

Page

• Added the ESD Diodes Recommendations Characteristics table.................................................................... 22

• Changed recommended RESD for Nexperia from none to 2Ω.......................................................................... 22

Changes from Revision A (November 2018) to Revision B (October 2023)

Page

• Updated the numbering format for tables, figures, and cross-references throughout the document................. 1

• Updated the Device Information table to include ambient temperature .............................................................1

• Updated the TUSB1002A in ESB3.2 x1 Host Application figure to include ESD and optional 220kΩ pulldown

on RX pins........................................................................................................................................................19

• Updated the Design Parameters table to include pre-channel and post-channel min/max limits.....................20

• Changed 100nF recommendation to 220nF for ac-coupling capacitors ..........................................................20

• Added the ESD Protection section................................................................................................................... 22

Changes from Revision * (March 2018) to Revision A (November 2018)

Page

• Changed text from: "Inclusion of these 330nF capacitors and 220kΩ resistors is optional but highly

recommended." to: "Inclusion of the 330nF capacitors and 220kΩ resistors is optional." in the Detailed Design

Procedure ........................................................................................................................................................ 20

• Added ordered list of implementation options for USB connector to TUSB1002A RX pins ............................ 20

TUSB1002A

SLLSF63C – MARCH 2018 – REVISED JULY 2024

www.ti.com

28

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