5 Specifications

5.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)

MIN

MAX

UNIT

Supply Voltage

Range

VCC

-0.3

4

V

Voltage Range

on I/O pins

Differential voltage for RX1P/N and RX2P/N

-2.5

2.5

V

Voltage at RX pins

-0.5

4

V

Voltage on Control pins

-0.5

4

V

Tstg

Storage temperature

-65

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Rating may cause permanent damage to the device. These are stress

ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated

under Recommended Operating Condition. Exposure to absolute-maximum-rated conditions for extended periods may affect device

reliability.

5.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic discharge

Human body model (HBM), per ANSI/ESDA/

JEDEC JS-001, all pins(1)

±5000

V

Charged device model (CDM), per JEDEC

specification JESD22-C101, all pins(2)

±1500

(1)

JEDEC document JEP155 states that 500V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250V CDM allows safe manufacturing with a standard ESD control process.

5.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

VCC

Supply voltage

3

3.3

3.6

V

VPSN

Supply noise on VCC pins

100

mV

TA

TUSB1002A Ambient temperature

0

70

°C

TUSB1002AI Ambient temperature

-40

85

°C

TJ

TUSB1002A Junction temperature

0

105

°C

TUSB1002AI Junction temperature

-40

105

°C

5.4 Thermal Information

THERMAL METRIC(1)

TUSB1002A

UNIT

RGE (VQFN)

24 PINS

RθJA

Junction-to-ambient thermal resistance

38.5

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

41.6

°C/W

RθJB

Junction-to-board thermal resistance

16.3

°C/W

ΨJT

Junction-to-top characterization parameter

1.0

°C/W

ΨJB

Junction-to-board characterization parameter

16.4

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

6.9

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

note.

www.ti.com

TUSB1002A

SLLSF63C – MARCH 2018 – REVISED JULY 2024

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