ADGM3121BCCZ-R2 datasheet(10/33 Pages) AD

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Data Sheet

ADGM3121

ABSOLUTE MAXIMUM RATINGS

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Rev. 0 | 10 of 33

TA = 25°C, unless otherwise noted.

Table 3. Absolute Maximum Ratings

Parameter

Rating

VDD to AGND

−0.3V to +6V

Digital Inputs1

−0.3V to VDD + 0.3V or 30mA (whichever

occurs first).

Switch DC Rating2

Voltage

±7V

Current

220mA

VCP

82V

Stand Off Voltage3

±10V

RF Power Rating4

34dBm

Operating Temperature Range

−40°C to +85°C

Storage Temperature Range

−65°C to +150°C

Reflow Soldering (Pb-Free)

Peak Temperature

260(+0/−5)°C

Time at Peak Temperature

10sec to 30sec

Group D

Mechanical Shock5

1500g with 0.5ms pulse

Vibration

20Hz to 2000Hz acceleration at 50g

Constant Acceleration

30,000g

1 Limit the current to the maximum ratings shown.

2 This rating is with respect to the switch in the on position with no RF signal

applied.

3 This rating is with respect to the switch in the off position with no RF signal

applied.

4 This rating is with respect to the switch in the on position and terminated into

50Ω.

5 If a device is dropped during handling, do not use the device.

Stresses at or above those listed under Absolute Maximum Ratings

may cause permanent damage to the product. This is a stress

rating only; functional operation of the product at these or any other

conditions above those indicated in the operational section of this

specification is not implied. Operation beyond the maximum operat-

ing conditions for extended periods may affect product reliability.

Only one absolute maximum rating may be applied at any one time.

THERMAL RESISTANCE

Thermal performance is directly linked to printed circuit board

(PCB) design and operating environment. Careful attention to PCB

thermal design is required.

θJA is the natural convection junction to ambient thermal resistance

measured in a one cubic foot sealed enclosure.

θJCT is the junction to the top of the case thermal resistance.

θJCB is the junction to the bottom of the case thermal resistance.

Table 4. Thermal Resistance

Package Type θJA

θJCT

θJCB

Unit

CC-24-23

68.1

161.7

93.7

°C/W

ELECTROSTATIC DISCHARGE (ESD) RATINGS

The following ESD information is provided for the handling of

ESD-sensitive devices in an ESD-protected area only.

Human body model (HBM) as per ANSI/ESDA/JEDEC JS-001.

Field-induced charged device model (FICDM) per ANSI/ESDA/JE-

DEC JS-002.

ESD Ratings for the ADGM3121

Table 5. ADGM3121, 24-Lead LGA

ESD Model

Withstand Threshold

Class

HBM1

150V for RFxx and RFCx2 pins

2kV for all other pins

FICDM3

1kV

1 Take proper precautions during handling, as outlined in the Handling Precau-

tions section.

2 RFxx is RF1A, RF1B, RF2A, and RF2B. RFCx is RFCA and RFCB.

3 A safe automated handling and assembly process is achieved at this rating

level by implementing industry standard ESD controls.

ESD CAUTION

ESD (electrostatic discharge) sensitive device. Charged

devices and circuit boards can discharge without detection.

Although this product features patented or proprietary protec-

tion circuitry, damage may occur on devices subjected to high

energy ESD. Therefore, proper ESD precautions should be

taken to avoid performance degradation or loss of functionality.

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