AD8330ACP-R2 datasheet(32/36 Pages) AD

32 / 36 page

AD8330

Rev. D | Page 32 of 36

OUTLINE DIMENSIONS

*COMPLIANT TO JEDEC STANDARDS MO-220-VEED-2

EXCEPT FOR EXPOSED PAD DIMENSION.

0.50

BSC

0.60 MAX

PIN 1

INDICATOR

1.50 REF

0.50

0.40

0.30

0.25 MIN

0.45

2.75

BSC SQ

TOP

VIEW

12° MAX

0.80 MAX

0.65 TYP

SEATING

PLANE

PIN 1

INDICATOR

0.90

0.85

0.80

0.30

0.23

0.18

0.05 MAX

0.02 NOM

0.20 REF

3.00

BSC SQ

*1.65

1.50 SQ

1.35

EXPOSED

PAD

BOTTOM VIEW

THE EXPOSED PAD IS NOT CONNECTED

INTERNALLY. FOR INCREASED RELIABILITY

OF THE SOLDER JOINTS AND MAXIMUM

THERMAL CAPABILITY, IT IS RECOMMENDED

THAT THE PADDLE BE SOLDERED TO THE

GROUND PLANE.

Figure 78. 16-Lead Lead Frame Chip Scale Package [LFCSP_VQ]

3 mm × 3 mm Body, Very Thin Quad

(CP-16-3)

Dimensions shown in millimeters

COMPLIANT TO JEDEC STANDARDS MO-137-AB

PIN 1

SEATING

PLANE

0.010

0.004

0.012

0.008

0.025

BSC

0.010

0.006

0.050

0.016

8°

0°

COPLANARITY

0.004

0.065

0.049

0.069

0.053

0.197

0.193

0.189

0.158

0.154

0.150

0.244

0.236

0.228

Figure 79. 16-Lead Shrink Small Outline Package [QSOP]

(RQ-16)

Dimensions shown in inches

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