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MPC7441 数据表(PDF) 24 Page - Freescale Semiconductor, Inc |
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MPC7441 数据表(HTML) 24 Page - Freescale Semiconductor, Inc |
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24 / 60 page ![]() MPC7448 RISC Microprocessor Hardware Specifications, Rev. 4 24 Freescale Semiconductor Pin Assignments 6 Pin Assignments Figure 12 (in Part A) shows the pinout of the MPC7448, 360 high coefficient of thermal expansion ceramic ball grid array (HCTE) package as viewed from the top surface. Part B shows the side profile of the HCTE package to indicate the direction of the top surface view. Figure 12. Pinout of the MPC7448, 360 HCTE Package as Viewed from the Top Surface A B C D E F G H J K L M N P R T 12 3 4 5 6 78 910 11 12 13 14 15 16 Not to Scale 17 18 19 U V W Part A View Part B Die Substrate Assembly Encapsulant |
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