MPC7441 datasheet(29/60 Pages) FREESCALE

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MPC7441 数据表(PDF) 29 Page - Freescale Semiconductor, Inc

部件名	MPC7441

功能描述	RISC Microprocessor Hardware Specifications

PDF	60 Pages

Scroll/Zoom	100%

制造商	FREESCALE [Freescale Semiconductor, Inc]

网页	http://www.freescale.com

标志

29 / 60 page

MPC7448 RISC Microprocessor Hardware Specifications, Rev. 4

Freescale Semiconductor

Package Description

The following sections provide the package parameters and mechanical dimensions for the HCTE

package.

8.1

Package Parameters for the MPC7448, 360 HCTE BGA

The package parameters are as provided in the following list. The package type is 25

× 25 mm, 360-lead

high coefficient of thermal expansion ceramic ball grid array (HCTE).

Package outline

× 25 mm

Interconnects

360 (19

× 19 ball array – 1)

Pitch

1.27 mm (50 mil)

Minimum module height

2.32 mm

Maximum module height

2.80 mm

Ball diameter

0.89 mm (35 mil)

Coefficient of thermal expansion12.3 ppm/°C

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