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MPC7441 数据表(PDF) 33 Page - Freescale Semiconductor, Inc |
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MPC7441 数据表(HTML) 33 Page - Freescale Semiconductor, Inc |
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33 / 60 page ![]() MPC7448 RISC Microprocessor Hardware Specifications, Rev. 4 Freescale Semiconductor 33 Package Description 8.5 Package Parameters for the MPC7448, 360 HCTE RoHS-Compliant BGA The package parameters are as provided in the following list. The package type is 25 × 25 mm, 360-lead high coefficient of thermal expansion ceramic ball grid array (HCTE) with RoHS-compliant lead-free spheres. Package outline 25 × 25 mm Interconnects 360 (19 × 19 ball array – 1) Pitch 1.27 mm (50 mil) Minimum module height 1.92 mm Maximum module height 2.40 mm Ball diameter 0.75 mm (30 mil) Coefficient of thermal expansion12.3 ppm/°C |
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