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MPC8309CVMADDC 数据表(PDF) 30 Page - NXP Semiconductors |
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MPC8309CVMADDC 数据表(HTML) 30 Page - NXP Semiconductors |
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30 / 81 page ![]() MPC8309 PowerQUICC II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 3 30 Freescale Semiconductor TDM/SI The following figure provides the data and command output timing diagram. Figure 18. IEEE1588 Output AC Timing The following figure provides the data and command input timing diagram. Figure 19. IEEE1588 Input AC Timing 9TDM/SI This section describes the DC and AC electrical specifications for the time-division-multiplexed and serial interface of the MPC8309. 9.1 TDM/SI DC Electrical Characteristics The following table provides the DC electrical characteristics for the MPC8309 TDM/SI. Table 28. TDM/SI DC Electrical Characteristics Characteristic Symbol Condition Min Max Unit Output high voltage VOH IOH = –2.0 mA 2.4 — V Output low voltage VOL IOL = 3.2 mA — 0.5 V Input high voltage VIH —2.0 OVDD +0.3 V Input low voltage VIL —–0.3 0.8 V Input current IIN 0 V VIN OVDD —±5 A TSEC_1588_CLK_OUT TSEC_1588_PULSE_OUT TSEC_1588_TRIG_OUT tT1588OV tT1588CLKOUT tT1588CLKOUTH Note: The output delay is count starting rising edge if tT1588CLKOUT is non-inverting. Otherwise, it is count starting falling edge. TSEC_1588_CLK TSEC_1588_TRIG_IN tT1588TRIGH tT1588CLK tT1588CLKH |
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