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MPC8309CVMADDC 数据表(PDF) 78 Page - NXP Semiconductors |
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MPC8309CVMADDC 数据表(HTML) 78 Page - NXP Semiconductors |
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78 / 81 page ![]() MPC8309 PowerQUICC II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 3 78 Freescale Semiconductor Ordering Information The following table summarizes the signal impedance targets. The driver impedance is targeted at minimum VDD, nominal OVDD, 105C. 25.5 Configuration Pin Multiplexing The MPC8309 provides the user with power-on configuration options which can be set through the use of external pull-up or pull-down resistors of 4.7 k on certain output pins (Refer to the “Reset, Clocking and Initialization” of MPC8309 PowerQUICC II Pro Integrated Communications Processor Family Reference Manual). These pins are generally used as output only pins in normal operation. While HRESET is asserted however, these pins are treated as inputs. The value presented on these pins while HRESET is asserted, is latched when HRESET deasserts, at which time the input receiver is disabled and the I/O circuit takes on its normal function. Careful board layout with stubless connections to these pull-up/pull-down resistors coupled with the large value of the pull-up/pull-down resistor should minimize the disruption of signal quality or speed for output pins thus configured. 26 Ordering Information This section presents ordering information for the devices discussed in this document, and it shows an example of how the parts are marked. Ordering information for the devices fully covered by this document is provided in Section 26.1, “Part Numbers Fully Addressed by This Document.” 26.1 Part Numbers Fully Addressed by This Document The following table provides the Freescale part numbering nomenclature for the MPC8309 family. Note that the individual part numbers correspond to a maximum processor core frequency. For available frequencies, contact your local Freescale sales office. In addition to the maximum processor core frequency, the part numbering scheme also includes the maximum effective DDR memory speed and QUICC Engine bus frequency. Each part number also contains a revision code which refers to the die mask revision number. Table 65. Impedance Characteristics Impedance Local Bus, Ethernet, DUART, Control, Configuration and Power Management DDR DRAM Symbol Unit RN 42 Target 20 Target Z0 Ω RP 42 Target 20 Target Z0 Ω Differential NA NA ZDIFF Ω Note: Nominal supply voltages. See Table 1, Tj = 105C. |
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