ADIS16220

Rev. 0 | Page 16 of 20

APPLICATIONS INFORMATION

ASSEMBLY

When developing a process flow for installing ADIS16220 devices

on PCBs, see the JEDEC standard document J-STD-020C for

reflow temperature profile and processing information. The

ADIS16220 can use the Sn-Pb eutectic process and the Pb-free

eutectic process from this standard. See JEDEC J-STD-033 for

moisture sensitivity level (MSL) handling requirements. The

MSL rating for these devices is marked on the antistatic bags,

which protect these devices from ESD during shipping and

handling. Prior to assembly, review the process flow for informa-

tion about introducing shock levels that exceed the absolute

maximum ratings for the ADIS16220. PCB separation and

ultrasonic cleaning processes can introduce high levels of shock

and can damage the MEMS element. Bowing or flexing the PCB

after solder reflow can also place large pealing stress on the pad

structure and can damage the device. If this is unavoidable,

consider using an underfill material to help distribute these

forces across the bottom of the package. Tasca

GETTING STARTED QUICKLY

Once the ADIS16220 has a power supply voltage that reaches

3.15 V, it executes a start-up sequence that places the device in

manual capture mode. The following code example initiates a

manual data capture by setting GLOB_CMD[11] = 1 (DIN =

0xBF08) and reads all 1024 samples in the acceleration capture

buffer, using DIN = 0x1400. The data from the first spi_reg_

read is not valid because this command is starting the process.

The second spi_reg_read command (first read inside the

embedded For loop) produces the first valid data. This code

sequence produces CS, SCLK, and DIN signals similar to the

ones found in Figure 12.

spi_write(BF08h);

delay 30ms;

Data(0) = spi_reg_read(14h);

For n = 0 to 1023

Data(n) = spi_reg_read(14h);

n = n + 1;

end

INTERFACE BOARD

The ADIS16220/PCBZ provides the ADIS16220 function

on a 1.2 inch × 1.3 inch printed circuit board (PCB), which

simplifies the connection to an existing processor system.

The four mounting holes accommodate either M2 (2mm) or

Type 2-56 machine screws. These boards are made of IS410

material and are 0.063 inches thick. The second level assembly

uses a SAC305-compatible solder composition (Pb-free), which

has a presolder reflow thickness of approximately 0.005 inches.

The pad pattern on the ADIS16220/PCBZ matches that shown in

Figure 5. J1 and J2 are dual-row, 2 mm (pitch) connectors that

work with a number of ribbon cable systems, including 3M Part

Number 152212-0100-GB (ribbon-crimp connector) and 3M Part

Number 3625/12 (ribbon cable).

1

SCLK

2

DOUT

3

DIN

4

CS

13

VDD

9

RST

15

VREF

14

AIN1

12

AIN2

6

DIO2

5

DIO1

7

10

8

11

ADIS16220CCCZ

16

GND

NC

NC

NC

NC

1

2

3

4

6

10

11

7

8

12

5

9

J1

C1

1

3

11

12

6

10

7

8

5

9

J2

11

12

9

10

7

8

5

6

3

4

1

2

J1/J2 PIN NUMBERS

2

4

Figure 17. Electrical Schematic

iSensor

U1

J1

C1

J2

1.050

2 ×0.925

2 ×0.673

2 ×0.000

0.150

4 × Ø0.087

M2×0.4

Figure 18. PCB Assembly View and Dimensions