SPBT2532C2AT datasheet(18/48 Pages) STMICROELECTRONICS

部件名	SPBT2532C2AT

功能描述	Bluetooth technology class-2 module

PDF	48 Pages

Scroll/Zoom	100%

制造商	STMICROELECTRONICS [STMicroelectronics]

网页	http://www.st.com

标志

18 / 48 page

Soldering

SPBT2532C2.AT

18/48

Doc ID 16089 Rev 3

Soldering

Soldering phase has to be executed with care: In order to avoid undesired melting

phenomenon, particular attention has to be taken on the set up of the peak temperature.

Here following some suggestions for the temperature profile based on

IPC/JEDEC J-STD-020C, July 2004 recommendations.

Figure 8.

Soldering

Table 7.

Soldering

Profile feature

PB-free assembly

Average ramp up rate (TSMAX to TP)

3°C / sec max

Preheat

Temperature min (TS min)

Temperature max (TS max)

Time (tS min to tS max) (tS)

150 °C

200 °C

60-100 sec

Time maintained above:

Temperature TL

Time tL

217 °C

60-70 sec

Peak temperature (TP)

240 + 0 °C

Time within 5 °C of actual peak temperature (tP)

10-20 sec

Ramp down rate

6 °C / sec

Time from 25 °C to peak temperature

8 minutes max

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