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数据搜索系统，热门电子元器件搜索 |
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数据搜索系统，热门电子元器件搜索 |
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430 数据表(PDF) 92 Page - Intel Corporation |
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430 数据表(HTML) 92 Page - Intel Corporation |
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92 / 100 page  Boxed Processor Specifications 92 Datasheet 7.1 Mechanical Specifications 7.1.1 Boxed Processor Cooling Solution Dimensions This section documents the mechanical specifications of the boxed processor. The boxed processor will be shipped with an unattached fan heatsink. Figure 23 shows a mechanical representation of the boxed processor. Clearance is required around the fan heatsink to ensure unimpeded airflow for proper cooling. The physical space requirements and dimensions for the boxed processor with assembled fan heatsink are shown in Figure 24 (Side View), and Figure 25 (Top View). The airspace requirements for the boxed processor fan heatsink must also be incorporated into new baseboard and system designs. Airspace requirements are shown in Figure 29 and Figure 30. Note that some figures have centerlines shown (marked with alphabetic designations) to clarify relative dimensioning. Figure 24. Space Requirements for the Boxed Processor (Side View) Boxed_Proc_SideView 95.0 [3.74] 10.0 [0.39] 25.0 [0.98] 81.3 [3.2] |
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