430 datasheet(3/100 Pages) INTEL

3 / 100 page

Datasheet

Contents

1Introduction ..............................................................................................................9

1.1

Terminology .......................................................................................................9

1.1.1

Processor Packaging Terminology ............................................................. 10

1.2

References ....................................................................................................... 11

Electrical Specifications ........................................................................................... 13

2.1

Power and Ground Lands.................................................................................... 13

2.2

Decoupling Guidelines........................................................................................ 13

2.2.1

Vcc Decoupling ...................................................................................... 13

2.2.2

Vtt Decoupling ....................................................................................... 13

2.2.3

FSB Decoupling...................................................................................... 14

2.3

Voltage Identification ......................................................................................... 14

2.4

Market Segment Identification (MSID) ................................................................. 16

2.5

Reserved, Unused and TESTHI Signals ................................................................. 16

2.6

Voltage and Current Specification ........................................................................ 17

2.6.1

Absolute Maximum and Minimum Ratings .................................................. 17

2.6.2

DC Voltage and Current Specification ........................................................ 19

2.6.3

Vcc Overshoot ....................................................................................... 21

2.6.4

Die Voltage Validation ............................................................................. 22

2.7

Signaling Specifications...................................................................................... 22

2.7.1

FSB Signal Groups.................................................................................. 23

2.7.2

CMOS and Open Drain Signals ................................................................. 25

2.7.3

Processor DC Specifications ..................................................................... 25

2.7.3.1

GTL+ Front Side Bus Specifications ............................................. 27

2.8

Clock Specifications ........................................................................................... 28

2.8.1

Front Side Bus Clock (BCLK[1:0]) and Processor Clocking ............................ 28

2.8.2

FSB Frequency Select Signals (BSEL[2:0])................................................. 29

2.8.3

Phase Lock Loop (PLL) and Filter .............................................................. 29

2.8.4

BCLK[1:0] Specifications (CK505 based Platforms) ..................................... 30

2.8.5

BCLK[1:0] Specifications (CK410 based Platforms) ..................................... 32

2.9

PECI DC Specifications ....................................................................................... 34

Package Mechanical Specifications .......................................................................... 35

3.1

Package Mechanical Drawing............................................................................... 35

3.2

Processor Component Keep-Out Zones................................................................. 39

3.3

Package Loading Specifications ........................................................................... 39

3.4

Package Handling Guidelines............................................................................... 39

3.5

Package Insertion Specifications.......................................................................... 40

3.6

Processor Mass Specification............................................................................... 40

3.7

Processor Materials............................................................................................ 40

3.8

Processor Markings............................................................................................ 40

3.9

Processor Land Coordinates ................................................................................ 41

Land Listing and Signal Descriptions ....................................................................... 43

4.1

Processor Land Assignments ............................................................................... 43

4.2

Alphabetical Signals Reference ............................................................................ 66

Thermal Specifications and Design Considerations .................................................. 75

5.1

Processor Thermal Specifications ......................................................................... 75

5.1.1

Thermal Specifications ............................................................................ 75

5.1.2

Thermal Metrology ................................................................................. 78

5.2

Processor Thermal Features ................................................................................ 78

5.2.1

Thermal Monitor..................................................................................... 78

430 数据表(PDF) 3 Page - Intel Corporation

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