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430 数据表(PDF) 4 Page - Intel Corporation

部件名 430
功能描述  Supporting the Intel Celeron processor
PDF  100 Pages
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制造商  INTEL [Intel Corporation]
网页  http://www.intel.com
标志 INTEL - Intel Corporation

430 数据表(HTML) 4 Page - Intel Corporation

  430 Datasheet HTML 1Page - Intel Corporation 430 Datasheet HTML 2Page - Intel Corporation 430 Datasheet HTML 3Page - Intel Corporation 430 Datasheet HTML 4Page - Intel Corporation 430 Datasheet HTML 5Page - Intel Corporation 430 Datasheet HTML 6Page - Intel Corporation 430 Datasheet HTML 7Page - Intel Corporation 430 Datasheet HTML 8Page - Intel Corporation 430 Datasheet HTML 9Page - Intel Corporation Next Button
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Datasheet
5.2.2
Thermal Monitor 2 ..................................................................................79
5.2.3
On-Demand Mode...................................................................................80
5.2.4
PROCHOT# Signal ..................................................................................81
5.2.5
THERMTRIP# Signal ................................................................................81
5.3
Thermal Diode...................................................................................................82
5.4
Platform Environment Control Interface (PECI) ......................................................84
5.4.1
Introduction...........................................................................................84
5.4.1.1
Key Difference with Legacy Diode-Based Thermal Management .......84
5.4.2
PECI Specifications .................................................................................86
5.4.2.1
PECI Device Address..................................................................86
5.4.2.2
PECI Command Support .............................................................86
5.4.2.3
PECI Fault Handling Requirements ...............................................86
5.4.2.4
PECI GetTemp0() Error Code Support ..........................................86
6Features ..................................................................................................................87
6.1
Power-On Configuration Options ..........................................................................87
6.2
Clock Control and Low Power States.....................................................................87
6.2.1
Normal State .........................................................................................88
6.2.2
HALT and Extended HALT Powerdown States ..............................................88
6.2.2.1
HALT Powerdown State ..............................................................88
6.2.2.2
Extended HALT Powerdown State ................................................89
6.2.3
Stop Grant State ....................................................................................89
6.2.4
HALT Snoop State and Stop Grant Snoop State...........................................90
7
Boxed Processor Specifications................................................................................91
7.1
Mechanical Specifications....................................................................................92
7.1.1
Boxed Processor Cooling Solution Dimensions.............................................92
7.1.2
Boxed Processor Fan Heatsink Weight .......................................................94
7.1.3
Boxed Processor Retention Mechanism and Heatsink Attach Clip Assembly .....94
7.2
Electrical Requirements ......................................................................................94
7.2.1
Fan Heatsink Power Supply ......................................................................94
7.3
Thermal Specifications........................................................................................95
7.3.1
Boxed Processor Cooling Requirements......................................................95
7.3.2
Variable Speed Fan .................................................................................97
8
Debug Tools Specifications ......................................................................................99
8.1
Logic Analyzer Interface (LAI) .............................................................................99
8.1.1
Mechanical Considerations .......................................................................99
8.1.2
Electrical Considerations ..........................................................................99



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