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Package Mechanical Specifications

3.2

Processor Component Keep-Out Zones

The processor may contain components on the substrate that define component keep-

out zone requirements. A thermal and mechanical solution design must not intrude into

the required keep-out zones. Decoupling capacitors are typically mounted to either the

topside or land-side of the package substrate. See Figure 9 and Figure 10 for keep-out

zones. The location and quantity of package capacitors may change due to

manufacturing efficiencies but will remain within the component keep-in.

3.3

Package Loading Specifications

Table 20 provides dynamic and static load specifications for the processor package.

These mechanical maximum load limits should not be exceeded during heatsink

assembly, shipping conditions, or standard use condition. Also, any mechanical system

or component testing should not exceed the maximum limits. The processor package

substrate should not be used as a mechanical reference or load-bearing surface for

thermal and mechanical solution. The minimum loading specification must be

maintained by any thermal and mechanical solutions.

NOTES:

These specifications apply to uniform compressive loading in a direction normal to the

processor IHS.

This is the maximum force that can be applied by a heatsink retention clip. The clip must

also provide the minimum specified load on the processor package.

These specifications are based on limited testing for design characterization. Loading limits

are for the package only and do not include the limits of the processor socket.

Dynamic loading is defined as an 11 ms duration average load superimposed on the static

load requirement.

3.4

Package Handling Guidelines

Table 21 includes a list of guidelines on package handling in terms of recommended

maximum loading on the processor IHS relative to a fixed substrate. These package

handling loads may be experienced during heatsink removal.

NOTES:

A shear load is defined as a load applied to the IHS in a direction parallel to the IHS top

surface.

A tensile load is defined as a pulling load applied to the IHS in a direction normal to the

IHS surface.

A torque load is defined as a twisting load applied to the IHS in an axis of rotation normal

to the IHS top surface.

These guidelines are based on limited testing for design characterization.

Table 20.

Processor Loading Specifications

Parameter

Minimum

Maximum

Notes

Static

80 N [17 lbf]

311 N [70 lbf]

1, 2, 3

Dynamic

756 N [170 lbf]

1, 3, 4

Table 21.

Package Handling Guidelines

Parameter

Maximum Recommended

Notes

Shear

311 N [70 lbf]

1, 4

Tensile

111 N [25 lbf]

2, 4

Torque

3.95 N-m [35 lbf-in]

3, 4

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