MPC8343CVRADDB datasheet(19/79 Pages) FREESCALE

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MPC8343EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 10

Freescale Semiconductor

DDR and DDR2 SDRAM

Figure 5 shows the DDR SDRAM output timing for the MCK to MDQS skew measurement (tDDKHMH).

Figure 5. Timing Diagram for tDDKHMH

MDQS preamble start

tDDKHMP

–0.5

× t

MCK – 0.6

–0.5

× t

MCK + 0.6

MDQS epilogue end

tDDKHME

–0.6

0.6

Notes:

1. The symbols for timing specifications follow the pattern of t(first two letters of functional block)(signal)(state)(reference)(state) for inputs

and t(first two letters of functional block)(reference)(state)(signal)(state) for outputs. Output hold time can be read as DDR timing (DD) from

the rising or falling edge of the reference clock (KH or KL) until the output goes invalid (AX or DX). For example, tDDKHAS

symbolizes DDR timing (DD) for the time tMCK memory clock reference (K) goes from the high (H) state until outputs (A) are

set up (S) or output valid time. Also, tDDKLDX symbolizes DDR timing (DD) for the time tMCK memory clock reference (K) goes

low (L) until data outputs (D) are invalid (X) or data output hold time.

2. All MCK/MCK referenced measurements are made from the crossing of the two signals ±0.1 V.

3. ADDR/CMD includes all DDR SDRAM output signals except MCK/MCK, MCS, and MDQ/MECC/MDM/MDQS. For the

ADDR/CMD setup and hold specifications, it is assumed that the clock control register is set to adjust the memory clocks by

1/2 applied cycle.

4. tDDKHMH follows the symbol conventions described in note 1. For example, tDDKHMH describes the DDR timing (DD) from the

rising edge of the MCK(n) clock (KH) until the MDQS signal is valid (MH). tDDKHMH can be modified through control of the

DQSS override bits in the TIMING_CFG_2 register and is typically set to the same delay as the clock adjust in the CLK_CNTL

register. The timing parameters listed in the table assume that these two parameters are set to the same adjustment value.

See the MPC8349EA PowerQUICC II Pro Integrated Host Processor Family Reference Manual for the timing modifications

enabled by use of these bits.

5. Determined by maximum possible skew between a data strobe (MDQS) and any corresponding bit of data (MDQ), ECC

(MECC), or data mask (MDM). The data strobe should be centered inside the data eye at the pins of the microprocessor.

6. All outputs are referenced to the rising edge of MCK(n) at the pins of the microprocessor. Note that tDDKHMP follows the

symbol conventions described in note 1.

Table 20. DDR and DDR2 SDRAM Output AC Timing Specifications (continued)

At recommended operating conditions with GVDD of (1.8 or 2.5 V) ± 5%.

Parameter

Symbol 1

Min

Max

Unit

Notes

MDQS

MCK[n]

tMCK

MDQS

tDDKHMH(min) = –0.6 ns

tDDKHMHmax) = 0.6 ns

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