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MPC8343VRADDB 数据表(PDF) 50 Page - Freescale Semiconductor, Inc |
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MPC8343VRADDB 数据表(HTML) 50 Page - Freescale Semiconductor, Inc |
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50 / 79 page ![]() MPC8343EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 10 50 Freescale Semiconductor Package and Pin Listings 18.2 Mechanical Dimensions for the MPC8343EA PBGA Figure 35 shows the mechanical dimensions and bottom surface nomenclature for the MPC8343EA, 620-PBGA package. Notes: 1. All dimensions are in millimeters. 2. Dimensioning and tolerancing per ASME Y14. 5M-1994. 3. Maximum solder ball diameter measured parallel to datum A. 4. Datum A, the seating plane, is determined by the spherical crowns of the solder balls. Figure 35. Mechanical Dimensions and Bottom Surface Nomenclature for the MPC8343EA PBGA |
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