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ADAU1373BCBZ-R7 数据表(PDF) 21 Page - Analog Devices

部件名 ADAU1373BCBZ-R7
功能描述  Low Power Codec with Speaker and Headphone Amplifier
PDF  296 Pages
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制造商  AD [Analog Devices]
网页  http://www.analog.com
标志 AD - Analog Devices

ADAU1373BCBZ-R7 数据表(HTML) 21 Page - Analog Devices

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ADAU1373
Rev. 0 | Page 21 of 296
ABSOLUTE MAXIMUM RATINGS
THERMAL RESISTANCE
Table 7.
Parameter
Rating
Power Supply
SPKVDD, IOVDDx
−0.3 V to +5.5 V
DVDD, AVDD
−0.3 V to +1.98 V
HPVDD
−0.3 V to +1.98 V
Analog Input Voltage (Signal Pins)
AIN4R/AIN4N, AIN3R/AIN3N,
AIN2R/AIN2N, AIN1R/AIN1N,
AIN4L/AIN4P, AIN3L/AIN3P,
AIN2L/AIN4P, AIN1L/AIN1P
–0.3 V to AVDD + 0.3 V
Digital Input Voltage (Signal Pins)
MCLK1, BCLKA, LRCLKA, SDATAINA,
GPIO1
–0.3 V to IOVDD1 + 0.3 V
MCLK2, BCLKB, LRCLKB, SDATAINB,
GPIO2
–0.3 V to IOVDD2 + 0.3 V
BCLKC, LRCLKC, SDATAINC, GPIO3
–0.3 V to IOVDD3 + 0.3 V
DMIC1_2_DATA, DMIC3_4_DATA,
DMIC_CLK
–0.3 V to IOVDD4 + 0.3 V
SDA, SCL, GPIO4, MODE, ADDR, SD
–0.3 V to IOVDD5 + 0.3 V
Temperature
Operating Range
−40°C to +85°C
Storage Range
−65°C to +150°C
Junction Range
−65°C to +165°C
Lead Temperature (Soldering, 60 sec)
300°C
θJA is specified for the worst-case conditions, that is, a device
soldered in a circuit board for surface-mount packages.
Table 8. Thermal Resistance
Package Type
θJA
Unit
81-Lead, 4.0 mm × 3.8 mm WLCSP1
30
°C/W
1 Applicable for a 4-layer board. For more information on the WLCSP, see
the AN-617 Application Note, MicroCSP Wafer Level Chip Scale Package
.
ESD CAUTION
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.



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