AS5045

Data Sheet

www.austriamicrosystems.com

Revision 1.7

24 – 33

14.1 Physical Placement of the Magnet

The best linearity can be achieved by placing the center of the magnet exactly over the defined center of the chip as

shown in the drawing below:

Figure 18. Defined Chip Center and Magnet Displacement Radius

1

Defined

center

2.433 mm

2.433 mm

3.9 mm

3.9 mm

Area of recommended maximum

magnet misalignment

Magnet Placement

the IC.

The magnet may be placed below or above the device. The distance should be chosen such that the magnetic field

on the die surface is within the specified limits (see Figure 17). The typical distance “z” between the magnet and the

package surface is 0.5mm to 1.5mm, provided the use of the recommended magnet material and dimensions (6mm x

3mm). Larger distances are possible, as long as the required magnetic field strength stays within the defined limits.

However, a magnetic field outside the specified range may still produce usable results, but the out-of-range condition

will be indicated by MagINCn (pin 1) and MagDECn (pin 2), see Table 1.

Figure 19. Vertical Placement of the Magnet

1.282mm ± 0.15mm

0.576mm ± 0.1mm

z

S

N

Package surface

Die surface