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PCF8523T/1 数据表(PDF) 60 Page - NXP Semiconductors

部件名 PCF8523T/1
功能描述  Real-Time Clock (RTC) and calendar
PDF  75 Pages
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制造商  NXP [NXP Semiconductors]
网页  http://www.nxp.com
标志 NXP - NXP Semiconductors

PCF8523T/1 数据表(HTML) 60 Page - NXP Semiconductors

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PCF8523
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2012. All rights reserved.
Product data sheet
Rev. 4 — 5 July 2012
60 of 74
NXP Semiconductors
PCF8523
Real-Time Clock (RTC) and calendar
17.2 Wafer and Film Frame Carrier (FFC) information
SOT402-1 (TSSOP14) of PCF8523TS
A0
pocket width in x direction
6.95
mm
B0
pocket width in y direction
5.6
mm
K0
pocket depth
1.6
mm
P1
pocket hole pitch
8.0
mm
W
tape width in y direction
12.0
mm
Table 54.
Carrier tape dimensions of PCF8523 …continued
Symbol
Description
Value
Unit
(1) Die marking code.
Seal ring plus gap to active circuit ~18
m. Wafer thickness 200 m.
PCF8523U: bad die are marked in wafer mapping.
Fig 43. PCF8523U wafer information
013aaa232
Saw lane
~18
μm
45
μm
70
μm
~18
μm
detail X
1.449 mm
1.492 mm
1
1
1
1
X
straight edge
of the wafer
(1)



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