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WM8952ECS/RV 数据表(PDF) 70 Page - Wolfson Microelectronics plc |
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WM8952ECS/RV 数据表(HTML) 70 Page - Wolfson Microelectronics plc |
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70 / 72 page ![]() WM8952 Pre Production w PP, Rev 3.1, June 2011 70 PACKAGE DIAGRAM DM054.A B: 28 BALL W-CSP PACKAGE 2.590 X 2.500 X 0.7mm BODY, 0.40 mm BALL PITCH A1 CORNER TOP VIEW E Z 0.10 2 X D 5 4 DETAIL 2 DETAIL 2 A A2 2 Z 0.10 2 X A1 Z bbb Z 1 E1 A D1 DETAIL 1 D C B F E e e BOTTOM VIEW 1 65 4 3 2 6 G NOTES: 1. PRIMARY DATUM -Z- AND SEATING PLANE ARE DEFINED BY THE SPHERICAL CROWNS OF THE SOLDER BALLS. 2. THIS DIMENSION INCLUDES STAND-OFF HEIGHT ‘A1’ AND BACKSIDE COATING. 3. A1 CORNER IS IDENTIFIED BY INK/LASER MARK ON TOP PACKAGE. 4. BILATERAL TOLERANCE ZONE IS APPLIED TO EACH SIDE OF THE PACKAGE BODY. 5. ‘e’ REPRESENTS THE BASIC SOLDER BALL GRID PITCH. 6. THIS DRAWING IS SUBJECT TO CHANGE WITHOUT NOTICE. 7. FOLLOWS JEDEC DESIGN GUIDE MO-211-C. A1 0.195 D D1 E E1 e 2.000 BSC 2.500 BSC 0.275 2.000 BSC 0.400 BSC 2.590 BSC Dimensions (mm) Symbols MIN NOM MAX NOTE A 0.7 A2 0.385 0.410 0.435 5 f1 0.785 0.615 0.220 0.245 g 0.070 0.035 0.105 h 0.260 BSC f2 0.230 f1 f2 h |
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