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STM32F103C8T7 数据表(PDF) 83 Page - STMicroelectronics |
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STM32F103C8T7 数据表(HTML) 83 Page - STMicroelectronics |
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83 / 105 page  STM32F103x8, STM32F103xB Package characteristics Doc ID 13587 Rev 15 83/105 Figure 43. UFQFPN48 7 x 7 mm, 0.5 mm pitch, package outline 1. Drawing is not to scale. 2. There is an exposed die pad on the underside of the QFPN package, this pad is not internally connected to the VSS or VDD power pads. It is recommended to connect it to VSS. 3. All leads/pads should also be soldered to the PCB to improve the lead solder joint life. Table 52. UFQFPN48 7 x 7 mm, 0.5 mm pitch, package mechanical data Symbol millimeters inches(1) Min Typ Max Min Typ Max A 0.500 0.550 0.600 0.0197 0.0217 0.0236 A1 0.000 0.020 0.050 0.0000 0.0008 0.0020 D 6.900 7.000 7.100 0.2717 0.2756 0.2795 E 6.900 7.000 7.100 0.2717 0.2756 0.2795 L 0.300 0.400 0.500 0.0118 0.0157 0.0197 T 0.152 0.0060 b 0.200 0.250 0.300 0.0079 0.0098 0.0118 e 0.500 0.0197 ddd 0.080 0.0031 |
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