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OMAP3530ECBC72 数据表(PDF) 4 Page - Texas Instruments

部件名 OMAP3530ECBC72
功能描述  OMAP3530/25 Applications Processor: OMAP 3 Architecture
PDF  264 Pages
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制造商  TI1 [Texas Instruments]
网页  http://www.ti.com
标志 TI1 - Texas Instruments

OMAP3530ECBC72 数据表(HTML) 4 Page - Texas Instruments

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1.2 Description
OMAP3530/25 Applications Processor
SPRS507F – FEBRUARY 2008 – REVISED OCTOBER 2009
www.ti.com
OMAP3530 and OMAP3525 high-performance, applications processors are based on the enhanced
OMAP™ 3 architecture.
The OMAP™ 3 architecture is designed to provide best-in-class video, image, and graphics processing
sufficient to support the following:
• Streaming video
• 3D mobile gaming
• Video conferencing
• High-resolution still image
The device supports high-level operating systems (OSs), such as:
• Linux
• Windows CE
This OMAP device includes state-of-the-art power-management techniques required for high-performance
mobile products.
The following subsystems are part of the device:
• Microprocessor unit (MPU) subsystem based on the ARM Cortex™-A8 microprocessor
• IVA2.2 subsystem with a C64x+ digital signal processor (DSP) core
• POWERVR SGX™ subsystem for 3D graphics acceleration to support display and gaming effects
(3530 only)
• Camera image signal processor (ISP) that supports multiple formats and interfacing options connected
to a wide variety of image sensors
• Display subsystem with a wide variety of features for multiple concurrent image manipulation, and a
programmable interface supporting a wide variety of displays. The display subsystem also supports
NTSC/PAL video out.
• Level 3 (L3) and level 4 (L4) interconnects that provide high-bandwidth data transfers for multiple
initiators to the internal and external memory controllers and to on-chip peripherals
The device also offers:
• A comprehensive power and clock-management scheme that enables high-performance, low-power
operation, and ultralow-power standby features. The device also supports SmartReflex™ adaptative
voltage control. This power management technique for automatic control of the operating voltage of a
module reduces the active power consumption.
• Memory stacking feature using the package-on-package (POP) implementation (CBB and CBC
packages only)
OMAP30/25 devices are available in a 515-pin s-PBGA package (CBB suffix), 515-pin s-PBGA package
(CBC suffix), and a 423-pin s-PBGA package (CUS suffix). Some features of the CBB and CBC packages
are not available in the CUS package.
Table 1-1 lists the differences between the CBB, CBC, and CUS packages.
OMAP3530/25 Applications Processor
4
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