L6470PD datasheet(65/70 Pages) STMICROELECTRONICS

部件名	L6470PD

功能描述	dSPIN fully integrated microstepping motor driver with motion engine and SPI

PDF	70 Pages

Scroll/Zoom	100%

制造商	STMICROELECTRONICS [STMicroelectronics]

网页	http://www.st.com

标志

65 / 70 page

L6470

Package mechanical data

Doc ID16737 Rev 5

65/70

Package mechanical data

In order to meet environmental requirements, ST offers these devices in different grades of

ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®

specifications, grade definitions and product status are available at: www.st.com.

ECOPACK® is an ST trademark.

Table 57.

HTSSOP28 mechanical data

Dim.

Min.

Typ.

Max.

1.2

0.15

0.8

1.0

1.05

0.19

0.3

0.09

0.2

D (1)

Dimension “D” does not include mold flash, protrusions or gate burrs. Mold flash, protrusions or gate burrs

must not exceed 0.15 mm per side.

9.6

9.7

9.8

5.5

6.2

6.4

6.6

E1 (2)

Dimension “E1” does not include interlead flash or protrusions. Interlead flash or protrusions must not

exceed 0.25 mm per side.

4.3

4.4

4.5

2.8

e0.65

0.45

0.6

0.75

1.0

K0°

8°

aaa

0.1

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