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MPC8314VRADDA 数据表(PDF) 73 Page - Freescale Semiconductor, Inc |
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MPC8314VRADDA 数据表(HTML) 73 Page - Freescale Semiconductor, Inc |
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73 / 101 page ![]() MPC8314E PowerQUICC II Pro Processor Hardware Specifications, Rev. 2 Freescale Semiconductor 73 Package and Pin Listings 22.2 Mechanical Dimensions of the TEPBGA II This figure shows the mechanical dimensions and bottom surface nomenclature of the 620-pin TEPBGA II package. Figure 59. Mechanical Dimensions and Bottom Surface Nomenclature of the TEPBGA II 22.3 Pinout Listings This table provides the pin-out listing for the TEPBGA II package. Notes: 1. All dimensions are in millimeters. 2. Dimensions and tolerances per ASME Y14.5M-1994. 3. Maximum solder ball diameter measured parallel to datum A. 4. Datum A, the seating plane, is determined by the spherical crowns of the solder balls. |
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