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MPC8314VRADDA 数据表(PDF) 93 Page - Freescale Semiconductor, Inc |
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MPC8314VRADDA 数据表(HTML) 93 Page - Freescale Semiconductor, Inc |
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93 / 101 page ![]() MPC8314E PowerQUICC II Pro Processor Hardware Specifications, Rev. 2 Freescale Semiconductor 93 Thermal Accurate thermal design requires thermal modeling of the application environment using computational fluid dynamics software which can model both the conduction cooling and the convection cooling of the air moving through the application. Simplified thermal models of the packages can be assembled using the junction-to-case and junction-to-board thermal resistances listed in the thermal resistance table. More detailed thermal models can be made available on request. Heat sink vendors include the following list: Aavid Thermalloy 603-224-9988 80 Commercial St. Concord, NH 03301 Internet: www.aavidthermalloy.com Alpha Novatech 408-749-7601 473 Sapena Ct. #12 Santa Clara, CA 95054 Internet: www.alphanovatech.com International Electronic Research Corporation (IERC) 818-842-7277 413 North Moss St. Burbank, CA 91502 Internet: www.ctscorp.com Table 75. Heat Sinks and Junction-to-Case Thermal Resistance of MPC8314E TEPBGA II Heat Sink Assuming Thermal Grease Air Flow 29 29 mm TEBGA II Junction-to-Ambient Thermal Resistance AAVID 30 x 30 x 9.4 mm Pin Fin Natural Convection 14.4 AAVID 30 x 30 x 9.4 mm Pin Fin 0.5 m/s 11.4 AAVID 30 x 30 x 9.4 mm Pin Fin 1 m/s 10.1 AAVID 30 x 30 x 9.4 mm Pin Fin 2 m/s 8.9 AAVID 35 x 31 x 23 mm Pin Fin Natural Convection 12.3 AAVID 35 x 31 x 23 mm Pin Fin 0.5 m/s 9.3 AAVID 35 x 31 x 23 mm Pin Fin 1 m/s 8.5 AAVID 35 x 31 x 23 mm Pin Fin 2 m/s 7.9 AAVID 43 x 41 x 16.5 mm Pin Fin Natural Convection 12.5 AAVID 43 x 41 x 16.5 mm Pin Fin 0.5 m/s 9.7 AAVID 43 x 41 x 16.5 mm Pin Fin 1 m/s 8.5 AAVID 43 x 41 x 16.5 mm Pin Fin 2 m/s 7.7 Wakefield, 53 x 53 x 25 mm Pin Fin Natural Convection 10.9 Wakefield, 53 x 53 x 25 mm Pin Fin 0.5 m/s 8.5 Wakefield, 53 x 53 x 25 mm Pin Fin 1 m/s 7.5 Wakefield, 53 x 53 x 25 mm Pin Fin 2 m/s 7.1 |
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