TLP708 datasheet(8/13 Pages) TOSHIBA

部件名	TLP708

功能描述	Factory Automation (FA) Home Electrical Appliances Operates at high ambient temperatures up to 125

PDF	13 Pages

Scroll/Zoom	100%

制造商	TOSHIBA [Toshiba Semiconductor]

网页	http://www.semicon.toshiba.co.jp/eng

标志

8 / 13 page

TLP708,TLP708F

2012-08-07

PRECAUTIONS OF SURFACE MOUNTING TYPE PHOTOCOUPLER SOLDERING &

GENERAL STORAGE

(1) Precautions for Soldering

1) When Using Soldering Reflow

An example of a temperature profile when Sn-Pb eutectic solder is used:

An example of a temperature profile when lead(Pb)-free solder is used:

Reflow soldering should be performed no more than twice.

The mounting should be completed with the interval from the first to the last mountings being 2 weeks.

2) When using soldering flow (Applicable to both eutectic solder and lead (Pb)-free solder)

Apply preheating of 150

˚C for 60 to 120 seconds.

Mounting condition of 260

˚C or less within 10 seconds is recommended.

Flow soldering should be performed no more than once.

3) When using soldering iron (Applicable to both eutectic solder and Lead(Pb)-Free solder)

Complete soldering within 10 seconds for lead temperature not exceeding 260

˚C or within 3 seconds

not exceeding 350

˚C.

Heating by soldering iron should be performed no more than once per lead.

( °C )

TLP708 数据表(PDF) 8 Page - Toshiba Semiconductor