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TLP708 数据表(PDF) 9 Page - Toshiba Semiconductor

部件名 TLP708
功能描述  Factory Automation (FA) Home Electrical Appliances Operates at high ambient temperatures up to 125
PDF  13 Pages
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制造商  TOSHIBA [Toshiba Semiconductor]
网页  http://www.semicon.toshiba.co.jp/eng
标志 TOSHIBA - Toshiba Semiconductor

TLP708 数据表(HTML) 9 Page - Toshiba Semiconductor

Back Button TLP708 Datasheet HTML 5Page - Toshiba Semiconductor TLP708 Datasheet HTML 6Page - Toshiba Semiconductor TLP708 Datasheet HTML 7Page - Toshiba Semiconductor TLP708 Datasheet HTML 8Page - Toshiba Semiconductor TLP708 Datasheet HTML 9Page - Toshiba Semiconductor TLP708 Datasheet HTML 10Page - Toshiba Semiconductor TLP708 Datasheet HTML 11Page - Toshiba Semiconductor TLP708 Datasheet HTML 12Page - Toshiba Semiconductor TLP708 Datasheet HTML 13Page - Toshiba Semiconductor  
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TLP708,TLP708F
2012-08-07
9
(2) Precautions for General Storage
1) Do not store devices in places where they will be exposed to moisture or direct sunlight.
2) During transportation or storage of devices, follow the cautions indicated on the carton box.
3) The storage area temperature should be kept within a temperature range of 5
˚C
to 35
˚C, and the relative humidity should be maintained between 45% and 75%.
4) Do not store devices in the presence of harmful (especially corrosive) gases, or under dusty conditions.
5) Use storage areas where there is minimal temperature fluctuation. The solderability of the leads will be
degraded as rapid temperature changes can cause condensation to form on the stored devices,
resulting in lead oxidation or corrosion.
6) When repacking devices, use anti-static containers.
7) Do not apply any external force or load directly to devices when they are in storage.
8) If devices have been stored for more than two years, it is recommended that their solderability be tested
before they are used even if the above precautions have been followed.



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