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TLP708 数据表(PDF) 11 Page - Toshiba Semiconductor |
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TLP708 数据表(HTML) 11 Page - Toshiba Semiconductor |
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11 / 13 page ![]() TLP708,TLP708F 2012-08-07 11 3.5 Tape Specification (1) Tape material: Plastic (protection against electrostatics) (2) Dimensions: The tape dimensions are as shown in Figure 2 and Table 2. Figure 2 Tape Forms Table 2 Tape Dimension Unit: mm Unless otherwise specified: ±0.1 Symbol Dimension Remark A 10.4 ⎯ B 5.1 ⎯ D 7.5 Center line of indented square hole and sprocket hole E 1.75 Distance between tape edge and hole center F 12.0 Cumulative error (max) per 10 feed holes G 4.0 Cumulative error (max) per 10 feed holes K0 4.1 Internal space +0.1 −0.3 +0.1 −0.3 φ1.6 ± 0.1 2.0 ± 0.1 A FG φ1.5 +0.1 −0 0.4 ± 0.05 4.55 ± 0.2 K0 |
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