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TLP708 数据表(PDF) 1 Page - Toshiba Semiconductor

部件名 TLP708
功能描述  Factory Automation (FA) Home Electrical Appliances Operates at high ambient temperatures up to 125
PDF  13 Pages
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制造商  TOSHIBA [Toshiba Semiconductor]
网页  http://www.semicon.toshiba.co.jp/eng
标志 TOSHIBA - Toshiba Semiconductor

TLP708 数据表(HTML) 1 Page - Toshiba Semiconductor

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TLP708
2012-07-27
1
TOSHIBA
11-5J1
Weight: 0.26 g (t y p .)
4.58±0.25
9.7±0.3
0.4±0.1
1.27±0.2
1.25±0.25
7.62±0.25
1 2 3
6 5 4
11-5J1
Unit: mm
TLP708
TOSHIBA PHOTOCOUPLER GaAℓAs LED & PHOTO-IC
TLP708,TLP708F
Factory Automation (FA)
Home Electrical Appliances
Operates at high ambient temperatures up to 125
°C
The Toshiba TLP708 consists of a GaAℓAs light emitting diode and an integrated
high-gain, high-speed photodetector. The TLP708 is housed in the SDIP6 package.
Compared to the standard DIP8 package, TLP708 is smaller in size, yet comes with
international safety standards under a reinforced isolation category. As such, it is
possible to reduce the mounting footprint for applications that require certifications for
safety standards.
The photodetector has an open-collector output stage, and an internal Faraday shield
that provides a guaranteed common-mode transient immunity of ±15 kV/μs. As
TLP708 is also able to operate up to 125
℃, it is suitable for use in applications like
industrial equipments where it is necessary to operate under high ambient
temperatures.
TLP708F is of a long creepage distance and clearance distance type.
Input threshold current :
IFHL = 5mA (Max)
Switching time (tpHL/tpLH):
75ns (Max)
Data transfer rate:
15 MBd (Typ.)
Guaranteed Performance over temperature:
-40 to 125
Power supply voltage:
4.5 to 5.5V
Common mode transient immunity:
±15 kV /μs (Min)
Isolation voltage:
5000Vrms (Min)
Construction mechanical rating
UL recognized:
UL1577, File No. E67349
cUL recognized:
CSA Component Acceptance Service No.5A,
File No. E67349
VDE-approved: Option (D4) EN60747-5-2 (Note)
Note: When an EN60747-5-2 approved type is needed,
please designate the Option (D4).Option (D4) Type
Pin Configuration (Top View)
7.62 mm Pitch
TLP708 Type
10.16 mm Pitch
TLP708F Type
Creepage distance
Clearance distance
Insulation thickness
7.0 mm (min)
7.0 mm (min)
0.4 mm (min)
8.0 mm (min)
8.0 mm (min)
0.4 mm (min)
1:ANODE
2:N.C.
3:CATHODE
4:GND
5:VO(Output)
6:VCC
Weight: 0.26 g (t y p .)
TOSHIBA
11-5J101
4.58±0.25
0.4±0.1
1 2 3
1.27±0.2
6 5 4
11.7±0.3
0.75±0.25
7.62±0.25
11-5J101
Unit: mm
TLP708F
VCC
GND
SHIELD
1
3
4
5
6
2


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