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CD00001237 数据表(PDF) 93 Page - STMicroelectronics |
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CD00001237 数据表(HTML) 93 Page - STMicroelectronics |
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93 / 105 page ![]() ST6215C ST6225C 93/105 12.2 THERMAL CHARACTERISTICS Notes: 1. The power dissipation is obtained from the formula PD = PINT + PPORT where PINT is the chip internal power (IDDxVDD) and PPORT is the port power dissipation determined by the user. 2. The average chip-junction temperature can be obtained from the formula TJ = TA + PD x RthJA. Symbol Ratings Value Unit RthJA Package thermal resistance (junction to ambient) DIP28 SO28 SSOP28 55 75 110 °C/W PD Power dissipation 1) 500 mW TJmax Maximum junction temperature 2) 150 °C 1 |
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