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STM32F103CBU6 数据表(PDF) 88 Page - STMicroelectronics |
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STM32F103CBU6 数据表(HTML) 88 Page - STMicroelectronics |
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88 / 105 page  Package characteristics STM32F103x8, STM32F103xB 88/105 DocID13587 Rev 16 Figure 49. UFBGA100 - ultra fine pitch ball grid array, 7 x 7 mm, 0.50 mm pitch, package outline 1. Drawing is not to scale. A0C2_ME_V2 Seating plane A1 e F F D M Øb (100 balls) A E TOP VIEW BOTTOM VIEW 1 12 A1 ball identifier e A A2 Y X Z ddd Z D1 E1 eee Z Y X fff Ø Ø M M Z A3 A4 A1 ball index area Table 55. UFBGA100 - ultra fine pitch ball grid array, 7 x 7 mm, 0.50 mm pitch, package mechanical data Symbol millimeters inches(1) Min Typ Max Min Typ Max A 0.460 0.530 0.600 0.0181 0.0209 0.0236 A1 0.050 0.080 0.110 0.0020 0.0031 0.0043 A2 0.400 0.450 0.500 0.0157 0.0177 0.0197 A3 0.080 0.130 0.180 0.0031 0.0051 0.0071 A4 0.270 0.320 0.370 0.0106 0.0126 0.0146 b 0.200 0.250 0.300 0.0079 0.0098 0.0118 D 6.950 7.000 7.050 0.2736 0.2756 0.2776 D1 5.450 5.500 5.550 0.2146 0.2165 0.2185 E 6.950 7.000 7.050 0.2736 0.2756 0.2776 E1 5.450 5.500 5.550 0.2146 0.2165 0.2185 e 0.500 0.0197 F 0.700 0.750 0.800 0.0276 0.0295 0.0315 ddd 0.100 0.0039 eee 0.150 0.0059 fff 0.050 0.0020 1. Values in inches are converted from mm and rounded to 4 decimal digits. |
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